FIELD: electronic engineering. SUBSTANCE: in sealing electronic device envelope, heat insulating groove 2 is made coaxially in respect to evacuation hole on outer surface of envelope; its depth and maximum depth of penetration through bead 3 around groove are selected from mathematical equation given in description of invention. Method is implemented in device. EFFECT: reduced size of envelope, improved reliability of sealed joints. 2 dwg
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Authors
Dates
1995-12-27—Published
1987-10-12—Filed