METHOD FOR SEALING ENVELOPES OF ELECTRONIC DEVICES Russian patent published in 1995 - IPC

Abstract SU 1507112 A1

FIELD: electronic engineering. SUBSTANCE: in sealing electronic device envelope, heat insulating groove 2 is made coaxially in respect to evacuation hole on outer surface of envelope; its depth and maximum depth of penetration through bead 3 around groove are selected from mathematical equation given in description of invention. Method is implemented in device. EFFECT: reduced size of envelope, improved reliability of sealed joints. 2 dwg

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SU 1 507 112 A1

Authors

Knjazev I.A.

Admiralov A.V.

Jashchurin S.B.

Dates

1995-12-27—Published

1987-10-12—Filed