METHOD OF FINAL SEALING OF CHIP ASSEMBLY Russian patent published in 2015 - IPC H01J9/26 

FIELD: process engineering.

SUBSTANCE: invention relates to microelectronics, particularly, to final assembly of chip assemblies with inner vacuum and can be used for assembly of sealed devices enclosed in metal cases. Proposed sealing process consists in placing assembled chip assembly in vacuum chamber, evacuation or filling with working gas and sealing of chip assembly. At making of chip assembly case a circular heat-insulating groove and channel are made at a time. Then, case is places on chip assembly base with clearance to produce vapour-gas channel between case edges being soldered together, chip assembly and groove. Then, soldering is performed by laser beam so that the weld has incomplete fusion in the groove zone. Without interrupting the evacuation or gas filling process via vapour-gas channel, chip assembly if finally sealed by soldering incomplete fusion section by laser beam.

EFFECT: better manufacturability, higher quality of weld.

2 dwg