FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic engineering, in particular to a method for joint piercing of double mesh structures in cathode-grid units (CGU) of pulsed vacuum devices. In the workpieces of both grids with arbitrary curvature of the surface, which are fixed in the CGU, holes of a given shape and dimensions are alternately formed by means of a laser ablation method with experimentally determined parameters of laser radiation: radiation power density P, focal spot diameter d, focus depth 2Z, optical system focal distance F and laser beam convergence angle θ, by moving the focal spot according to a given program along the surface of the grid workpiece first closest to the lens, approaching the entire CGU assembly to the lens at a distance equal to the gap h between the grid workpieces, and subsequent formation of holes in the second grid workpiece. Evaporation products during piercing are removed from the treatment zone by an inert gas flow, do not fall on the ceramic surface and do not change its dielectric properties.
EFFECT: high accuracy of forming holes of a given shape and size, separated by bridges, in two electroconductive or dielectric workpieces with an arbitrary curvature of the surface, separated by a gap.
1 cl, 5 dwg
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Authors
Dates
2024-12-11—Published
2024-04-09—Filed