FIELD: electrical and radioelectronic equipment. SUBSTANCE: application of the antiadhesion layer is effected by filling of the radioelectronic unit with liquid dielectric at a kinematic viscosity of 4 St. Then the radioelectronic unit is placed in an autoclave and filled with a compound that is insoluble in liquid dielectric (the compound density being higher by 1.1 and more times), for example, an epoxy compound, at a temperature of 40 C and residual pressure of 0.66 to 2.66 kPa. Liquid dielectric is expelled from the gaps over the entire space of the radioelectronic unit. The filled compound is subjected to curing. EFFECT: enhanced dielectric strength of products by prevention of compound cracking. 1 dwg
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