FIELD: electrolytic zinc plating. SUBSTANCE: zinc plating electrolyte contains zinc oxide from 8 to 60 g/l, ammonium chloride from 180 to 250 g/l, joiner's or hide glue 2 to 4 g/l, syntanol ДС-10 from 5 to 12 g/l. Introduced additionally into electrolyte is dibutyl ether of trichloromethylphosphonic acid (2 to 6 g/l). EFFECT: enlarged range of working current density. 2 tbl
Title | Year | Author | Number |
---|---|---|---|
ACIDIC CADMIUM-PLATING ELECTROLYTE | 0 |
|
SU1588809A1 |
ELECTROLYTE FOR ELECTRODEPOSITION OF LUSTROUS ZINC COATINGS | 2024 |
|
RU2820435C1 |
ELECTROLYTE FOR ZINC PLATING | 1996 |
|
RU2120501C1 |
ZINC PLATING ELECTROLYTE | 0 |
|
SU1081241A1 |
ADDITIVE TO ZINC-PLATING ELECTROLYTES | 0 |
|
SU1177399A1 |
SHINNING ZINC-PLATING ELECTROLYTE | 1994 |
|
RU2063481C1 |
0 |
|
SU387038A1 | |
ZINK-PLATING ELECTROLYTE | 0 |
|
SU834259A1 |
ZINC-PLATING ELECTROLYTE | 0 |
|
SU1126632A1 |
ELECTROLYTE OF GALVANIZATION | 2005 |
|
RU2301289C1 |
Authors
Dates
1995-04-30—Published
1989-09-25—Filed