POLYMERIC MOLDING COMPOUND Russian patent published in 1994 - IPC

FIELD: manufacture of soundproof materials. SUBSTANCE: molding compound contains polyamide matrix, blend of a low-molecular weight organic silicon compound, tris-trimethylsiloxyphenyl silane and low-density polyethylene as the modifier, which is added into said polyamide matrix, and mixed 5-7 mm cuttings of aromatic polyamide-based fibers and glass/basalt fibers, 3:2, as the fibrous filler in the following mixing ratio, parts by weight: polyamide 52-68; tris-trimethylsiloxyphenyl silane 1-3; low-density polyethylene 1-5; fibrous filler 30-40. EFFECT: high soundproof capacity of the end product. 2 tbl