FIELD: electronic engineering. SUBSTANCE: conducting paste composing organic binder (ethyl cellulose), terpineol, dibutyl phthalate, capron acid, and mineral part based on finely dispersed silver and low-melting glass is additionally doped with fraction of alkylbenzene having boiling point of 280-340 C in the following proportion, mass percent: finely dispersed silver - 65-70; low-melting glass - 11-14; ethyl cellulose - 0.3-0.7; terpineol - 10-16; dibutyl phthalate - 0.7-1.3; capron acid - 0.3-0.9; alkylbenzene - 4.7-5.1. EFFECT: improved resolution of conducting paste for precision printing of complex-configuration patterns. 2 tbl
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METHOD FOR OBTAINING DIELECTRIC PASTE | 0 |
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Authors
Dates
1994-09-30—Published
1992-07-21—Filed