FIELD: radio and electronic engineering. SUBSTANCE: alumomagnesium alloy substrate is anodized in molten salts of sodium and potassium nitrates at 220 to 400 C; copper layer is applied by magnetron spraying of copper over entire surface followed by electric plating. EFFECT: provision for obtaining dense, very thick oxide layer possessing pore-free structure, reliable adhesion to base material within single process cycle , making it possible to apply copper layer by magnetron spraying followed by electric plating dispensing with intermediate operations. 6 dwg
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