METHOD OF MAKING MULTILAYER PRINTED CIRCUIT BOARDS ON HEAT-REMOVING SUBSTRATE Russian patent published in 2016 - IPC H05K3/46 

FIELD: radio engineering.

SUBSTANCE: invention relates to radio electronics, particularly to production of multilayer printed circuit boards. Proposed method of making multilayer printed circuit boards on heat-removing substrate on an initial workpiece, heat-removing substrate made from aluminium-silicon carbide (AlSiC) is coated with a dielectric layer with thickness from 2 to 10 mcm, galvanic growing and vacuum-plasma sputtering of metal conducting layer with total thickness from 10 to 100 mcm is carried out followed by performing known operations for making a multilayer printed circuit board according to a method of making layers successively.

EFFECT: improved heat removal from chips of multilayer printed circuit boards.

1 cl, 10 dwg, 1 tbl