FIELD: electrical engineering. SUBSTANCE: equipment includes sealed body filled with liquid dielectric where high-temperature semiconductor devices are positioned. Body is coupled to tilted heat exchanger by steam line. Heat exchanger has condensate line in which additional heat exchanger with internal ribs and liquid cooler for low-temperature devices are mounted. Additional heat exchanger is connected to main one. EFFECT: simplified design, improved cooling efficiency. 4 cl, 2 dwg
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