COOLING DEVICE FOR SEMICONDUCTOR POWER DEVICES Russian patent published in 2000 - IPC

FIELD: electrical engineering; static power converters. SUBSTANCE: thermosiphon-type cooling device has evaporator provided with vertical boiling channels intercommunicating on top through horizontal steam header and at bottom, through horizontal condensate header; it also has sealed case with vertical external ribs and condenser with internal condensation channels provided with upper steam inlet ports and lower condensate outlet ones. Horizontal steam header is connected to upper inlet steam ports via steam line. Condensate header is connected to lower condensate outlet ports through inclined condensate line. Boiling channels and some condensation channels are filled with intermediate liquid coolant. One or more semiconductor power devices are attached to external side of evaporator. External ribs of case are parallel to boiling and condensation channels. EFFECT: improved effectiveness of cooling device, reduced consumption of high-cost liquid dielectric. 12 cl, 2 dwg