FIELD: deposition of decorative copper coatings. SUBSTANCE: electrolyte for deposition of decorative copper coatings contains, g/l: copper sulfate (pentohydrate) 20-40; potassium pyrophosphate 200-250; citric acid 8-10; trilon B 20-25; ammonium acetate 8-15; ethylenediamine (70%) 15-20. EFFECT: higher efficiency. 1 tbl
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ELECTROLYTE FOR COPPER-PLATING ALUMINIUM AND ITS ALLOYS | 0 |
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Authors
Dates
1995-02-09—Published
1991-05-22—Filed