FIELD: electroplating.
SUBSTANCE: invention relates to the field of electroplating. Copper coatings are used to impart a number of functional properties to the surface - electrical conductivity, protection against corrosion and carburization of sections of steel products, ensuring adhesion of friction compositions to the steel base, etc. The method includes the preparation of an electrolyte and the deposition of copper at a cathode current density of 0.5-1.0 A/dm2, an electrolyte temperature of 20-25°C using soluble copper or insoluble anodes from an electrolyte containing copper (II) sulfate pentahydrate crystal hydrate 0.50 -0.75 mol/l, while 2-hydroxypropanoic acid is additionally introduced into the electrolyte in an amount of 0.75-1.00 mol/l and the pH of the solution is adjusted to 3.
EFFECT: obtaining finely crystalline copper coatings well adhered to the base with a high current efficiency.
1 cl, 3 tbl, 3 dwg
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Authors
Dates
2022-09-06—Published
2022-01-17—Filed