PROCESS OF MANUFACTURE OF PACKAGE OF MICROCIRCUIT Russian patent published in 1995 - IPC

FIELD: electronics. SUBSTANCE: package is driven to contact with polymer powder before gilding and metal parts of it are heated till protective polymer film is formed with electromagnetic field. By controlling frequency of alternating magnetic field one strives for achievement of bigger penetration depth of magnetic field into contact and assembly metal pads and it is equal or smaller than their lateral dimensions. Bonding on surface of ceramic body of package due to lower heat conduction will not manage to heat up owing to heat transfer from metal parts of package to temperature of adhesion of polymer particles to it. Further on bonded sections on package unprotected by polymer coat are coated with gold by plating or any other method. EFFECT: improved manufacturing efficiency.