METAL-CERAMIC HOUSING OF POWER SEMICONDUCTOR MODULE BASED ON HIGH-HEAT-CONDUCTING CERAMICS AND METHOD OF ITS MANUFACTURING Russian patent published in 2019 - IPC H01L23/06 

FIELD: electrical engineering.

SUBSTANCE: invention relates to semiconductor electronics and is intended for production of power semiconductor modules. Technical result is achieved by creation of original design of metal-ceramic housing of power semiconductor module. An important feature of this design is use of high-conductivity ceramics as material for ceramic base of housing, as well as use of metallized transition holes in ceramic base for electric contact of current-conducting elements of module on upper side of ceramic base with signal and power terminals, soldered to bottom side of ceramic base of housing. Materials for manufacturing of heat sink and rim in this technical solution are selected so that to reduce mechanical stresses arising at high-temperature soldering, which lead to cracking of ceramic base of housing and loss of efficiency of power semiconductor module.

EFFECT: technical result of invention is creation of tight metal-ceramic housing of power semiconductor module, having low mass-and-dimension parameters and providing efficient heat removal from active components of power module.

4 cl, 6 dwg