MICROWAVE HOUSING FOR MICROWAVE SEMICONDUCTOR ELECTRONICS PRODUCT Russian patent published in 2021 - IPC H01L23/55 H05K5/00 

FIELD: microwave electronics.

SUBSTANCE: invention relates to microwave electronics, namely to a case for surface mounting of a product of semiconductor microwave electronics. Disclosed is a microwave housing for a microwave semiconductor electronics product, having a base and a cover, which are hermetically connected by a metal rim, at least three through metallized holes are made in the base. There is at least one external "earthen" metallized bond area and at least one internal "earthen" metallized bond area corresponding to the external one in the central part of the outer and inner sides of the base. They are electrically connected in pairs. There are at least three external and at least three internal outputs corresponding to the external outputs along the periphery of the outer and inner sides of the base outside the external and corresponding internal ground metallized bond areas. The outputs are used for the location and subsequent connection of the crystal or crystals of the microwave product. All the outputs form at least two sections of the coplanar line, respectively, electrically connected in pairs. The grounded conductors of each section of the coplanar line are connected to the external and corresponding internal ground metallized bond areas and a metal rim, in which the base and the cover are made of diamond. The base, metal rim, external and corresponding internal "earthen" metallized bond areas, external and corresponding internal outputs, through metallized holes are made in the form of a single monolithic planar board. The metal rim is made along the perimeter of the single monolithic planar board. The metal rim, the outer and corresponding inner "earthen" metallized bond areas, the outer and corresponding inner outputs are made in the form of a multilayer metallized coating with high electrical conductivity. The cover has a three-dimensional shape. Its inner surface is covered with a multilayer metallized coating with high electrical conductivity. All external and internal "earthen" metallized bond areas corresponding to the external ones, all external and internal outputs corresponding to the external ones are connected in pairs by means of through metallized holes.

EFFECT: increasing the operating frequency to 40 GHz, reducing microwave losses, reducing the voltage standing wave ratio (VSWR), improving heat dissipation, simplifying the design, increasing reliability, expanding functionality while maintaining the electrical and radio shielding characteristics.

5 cl, 3 dwg