FIELD: radio industry. SUBSTANCE: flux for preservation of printed circuit boards contains the following components, mass percent: epoxy resin 1 to 5; ethyl acetate - the rest. Flux may additionally contain ethyl alcohol 1 to 20 mass percent. EFFECT: enhanced efficiency. 2 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
PRESERVING FLUX FOR SOLDERING USING LOW TEMPERATURE SOLDERS | 1992 |
|
RU2033911C1 |
PRESERVING FLUX FOR LOW-TEMPERATURE WELDING | 1994 |
|
RU2056990C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1759587A1 |
PRESERVING FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1776525A1 |
PRESERVING FLUX FOR SOLDERING | 0 |
|
SU1286381A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1722753A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING OF RADIO AND ELECTRONIC EQUIPMENT COMPONENTS | 1993 |
|
RU2043894C1 |
FLUX FOR SOLDERING AND TINNING | 0 |
|
SU1148746A1 |
FLUX FOR TINNING COPPER CONTACT SURFACES OF PRINTED CIRCUIT BOARDS | 0 |
|
SU1745477A1 |
0 |
|
SU453269A1 |
Authors
Dates
1995-05-20—Published
1992-07-23—Filed