FIELD: soldering of printed circuit boards in electronic industry. SUBSTANCE: flux contains, by weight of: rosin 10-20; ammonium chloride 0.7; toluene 5-10; stearic or oleic acid 0.5-1; ethyl acetate 2-5. EFFECT: reduced labour output for manufacture of printed circuit units and increased efficiency by reduced operating cycle. 2 tbl
Title | Year | Author | Number |
---|---|---|---|
PRESERVING FLUX FOR LOW-TEMPERATURE WELDING | 1994 |
|
RU2056990C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1759587A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1722753A1 |
LOW-TEMPERATURE SOLDERING AND TINNING FLUX | 0 |
|
SU1660910A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463143C2 |
FLUX FOR LOW TEMPERATURE SOLDERING | 0 |
|
SU1636207A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
FLUX FOR LOW-TEMPERATURE SOLDERING OF COMPONENTS OF RADIOELECTRONIC EQUIPMENT | 0 |
|
SU1602654A1 |
SOLDERING FLUX FOR WASHINGLESS LOW-TEMPERATURE SOLDERING | 1993 |
|
RU2096152C1 |
Authors
Dates
1995-09-20—Published
1993-07-12—Filed