FIELD: welding. SUBSTANCE: preserving flux for low-temperature welding contains the following components, wt.%: colophony 10-20, ethyl acetate 2-5 toluene 5-10, stearic or oleic acid 0.5-1, ammonium chloride 0.7, 1.2.4 - triazole or 1.2.3 - benzenetriazole 1.0 ethyl alcohol the rest. Application of flux to printed circuit board with long storage life does not arouse corrosion and provides for further soldering without its depreservation by organic solvents. Preserving flux is used for protection of lands of printed circuit boards from oxidation and contamination without washing off after storage for consequent soldering with low-temperature solders during the production of household tele- and radio equipment. EFFECT: facilitated manufacture. 2 tbl
Title | Year | Author | Number |
---|---|---|---|
FLUX FOR LOW-TEMPERATURE SOLDERING OF RADIO AND ELECTRONIC EQUIPMENT COMPONENTS | 1993 |
|
RU2043894C1 |
PRESERVING FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1776525A1 |
SOLDERING FLUX FOR WASHINGLESS LOW-TEMPERATURE SOLDERING | 1993 |
|
RU2096152C1 |
PRESERVING FLUX FOR SOLDERING USING LOW TEMPERATURE SOLDERS | 1992 |
|
RU2033911C1 |
COMPOSITION FOR REMOVING PRESERVER COATING | 0 |
|
SU1650388A1 |
PRESERVING COATING FOR PRINTED CIRCUIT BOARD | 0 |
|
SU1763117A1 |
PRESERVING FLUX FOR SOLDERING | 0 |
|
SU1286381A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
FLUX FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS | 0 |
|
SU1581530A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463143C2 |
Authors
Dates
1996-03-27—Published
1994-02-16—Filed