FIELD: soldering of elements of printed circuit boards. SUBSTANCE: flux has following components, mass %: epoxy resin 0.5-5.0; carboxylic acid 1-5; ethyl alcohol 20.0-65.0; ethyl acetate 20.0-77.5. Flux can contain methylethyl ketone in amount of 10% by mass and hydrocarbons: pentane, octane, in amount of 5% by mass. EFFECT: enhanced quality. 3 cl, 2 tbl
Title | Year | Author | Number |
---|---|---|---|
FLUX FOR PRESERVATION OF PRINTED CIRCUIT BOARDS | 1992 |
|
RU2035282C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1759587A1 |
PRESERVING FLUX FOR LOW-TEMPERATURE WELDING | 1994 |
|
RU2056990C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1722753A1 |
0 |
|
SU453269A1 | |
PRESERVING FLUX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1776525A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463143C2 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
SOLDERING FLUX FOR WASHINGLESS LOW-TEMPERATURE SOLDERING | 1993 |
|
RU2096152C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
Authors
Dates
1995-04-30—Published
1992-07-23—Filed