FIELD: plastic materials. SUBSTANCE: prepreg has, mas. p. : epoxysiliconorganic resin 100; polybutoxytitaniumphosphorooxane 4-8; 2,4,6-tri-(dimethylaminimethyl)-phenol 0.1-0.5; fiber glass filler 200-435. Prepreg consisting of, mass. p.: epoxysiliconorganic resin 100; polybutoxytitaniumphosphorooxane 7.5; 2,4,6-tri-(dimethylaminomethyl)-phenol 0.4, and fiber glass filler 200 shows the following properties: dielectric permeability at frequency 106 Hz is 3.5; angle tangent of dielectric loss is 0.01; strength retention after temperature effect at the range from -269 to +100 C is 99%. Prepreg is used in cryogenic engineering. EFFECT: enhanced quality of prepreg. 2 tbl
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Authors
Dates
1995-06-09—Published
1992-12-29—Filed