FIELD: plastic materials. SUBSTANCE: prepreg has, mas. p. : epoxysiliconorganic resin 100; polybutoxytitaniumphosphorooxane 4-8; 2,4,6-tri-(dimethylaminimethyl)-phenol 0.1-0.5; fiber glass filler 200-435. Prepreg consisting of, mass. p.: epoxysiliconorganic resin 100; polybutoxytitaniumphosphorooxane 7.5; 2,4,6-tri-(dimethylaminomethyl)-phenol 0.4, and fiber glass filler 200 shows the following properties: dielectric permeability at frequency 106 Hz is 3.5; angle tangent of dielectric loss is 0.01; strength retention after temperature effect at the range from -269 to +100 C is 99%. Prepreg is used in cryogenic engineering. EFFECT: enhanced quality of prepreg. 2 tbl
| Title | Year | Author | Number | 
|---|---|---|---|
| COMPOSITION FOR HEAT-SHIELDING COATING | 1992 | 
 | RU2043378C1 | 
| HEAT RESISTANT ADHESIVE COMPOSITION | 1992 | 
 | RU2061727C1 | 
| ELECTROCONDUCTIVE POLYMERIC COMPOSITION | 1992 | 
 | RU2016424C1 | 
| POLYAMIDE COMPOSITION | 1993 | 
 | RU2063406C1 | 
| PRESS-COMPOSITION | 1992 | 
 | RU2034876C1 | 
| GLASS-REINFORCED PLASTIC | 1990 | 
 | RU2015926C1 | 
| POLYMERIC COMPOSITION FOR CLEANING MOLDS | 1992 | 
 | RU2057770C1 | 
| METHOD FOR PRODUCTION OF AMINO-ALDEHYDE RESINS | 1993 | 
 | RU2045540C1 | 
| POLYMER COMPOSITION | 1992 | 
 | RU2032948C1 | 
| PROCESS FOR PREPARING PLASTICIZERS | 1992 | 
 | RU2034826C1 | 
Authors
Dates
1995-06-09—Published
1992-12-29—Filed