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2 061 727

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C1

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IPC

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Application

5064235/04, 1992-10-05

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Actual filing date

1992-10-05

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Published

1996-06-10

(72)

Inventor

Vojtenko L.I.Gol'Dshtejn Zh.I.Bondarevskij G.S.Kur'Jakova N.I.Karelina Eh.G.

(73)

Holder

Aktsionernoe Obshchestvo Otkrytogo Tipa Nauchno-Issledovatel'Skij Institut Plasticheskikh Mass Im.G.S.Petrova S Opytnym Moskovskim Zavodom Plastmass

HEAT RESISTANT ADHESIVE COMPOSITION Russian patent published in 1996 - IPC

Abstract RU 2061727 C1

FIELD: electronics and other branches of industry. SUBSTANCE: proposed composition contains (mass parts): organic resin 100, maleic imide being product of interaction of 4,4[bis-4-(p-aminophenoxy)phenyl]propane or aromatic oligoamide with maleic anhydride 15-35, inorganic powder filler 30-80. Proposed composition also may contain 15-20 mass parts of diluent. Mentioned above organic resin represents product of interaction of diane resin with organosilicon compound or with silicium organotitanium compound which contains 2-5 % of Si, 12-16 % of epoxy groups and 1.5-2 % of Ti. EFFECT: improves quality of desired product. 2 cl, 1 tbl

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RU 2 061 727 C1

Authors

Vojtenko L.I.

Gol'Dshtejn Zh.I.

Bondarevskij G.S.

Kur'Jakova N.I.

Karelina Eh.G.

Dates

1996-06-10—Published

1992-10-05—Filed

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