POURING COMPOUND Russian patent published in 1995 - IPC

Abstract RU 2039785 C1

FIELD: protection of electronic engineering against moisture. SUBSTANCE: pouring compound has, mas. p. epoxy-diane oligomer 100; polyethylenepolyamine 10-14 or polyhydroxypropylenediamine with molecular mass 300, not above 25-35; milled talc 5-16; milled mica or aluminium hydroxide 10-33; pigment 1-4, and dimethyltribromoaniline 15-35. EFFECT: enhanced quality of compound. 2 tbl

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RU 2 039 785 C1

Authors

Sergeeva T.M.

Skachenko T.L.

Shikhanova L.N.

Gorbunov N.I.

Samokhvalov E.P.

Rilo R.P.

Dates

1995-07-20—Published

1992-07-31—Filed