FIELD: sealing of electronic equipment items. SUBSTANCE: compound is prepared by addition to epoxy diane oligomer of mineral filler and amine solidifier such as polyoxypropylene diamine having molecular weight of 200 or monocyanoethyl diethylene triamine followed by stirring components till the mixture becomes homogeneous and is then subjected to ultrasound treatment for 30-600 s. EFFECT: improved properties of the sealing compound. 2 tbl
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Authors
Dates
1996-07-10—Published
1993-07-22—Filed