MOISTURE-PROTECTIVE FILLING COMPOUND Russian patent published in 2015 - IPC C08L63/02 C09K3/10 C08K5/17 C08K13/02 

FIELD: chemistry.

SUBSTANCE: invention relates to production of epoxy filling compounds used for moisture protection of electronic products, for example capacitors. The compound contains 100 w.p. epoxy diane resin, 22-30 w.p. isophoronediamine, 20 w.p. polyoxypropylene epoxide diluent and filler: ground mica 9-19 w.p., ground talc 5-9 w.p., pigment 1-2 w.p. The diluent, mixture of mineral filler materials and a pigment are added to the epoxy diane resin and stirred. A curing agent is added and stirred until a homogeneous mass is obtained. Capacitors or other articles are filled with the compound at room temperature and cured as follows: heating to 80°C for 30 min, then holding at 80°C for 60 min, heating to 100°C for 30 min, then holding at 100°C for 60 min, heating to 120°C for 30 min, holding at 120°C for 60 min, cooling; or as follows: holding at room temperature for one day and polymerising at 120°C for 4 hours.

EFFECT: filling compound has improved electrical insulation properties at operating temperature higher than 125°C, while maintaining the level of moisture resistance and thermal shock resistance.

2 tbl