FIELD: production of electronic equipment. SUBSTANCE: soldering paste contains mixture of tin-lead solder and flux with solder-flux ratio of 85: 15, and powder filler of molybdenum permalloy with the following ratio, by weight: filler 10-14; solder-flux mixture the balance. EFFECT: increased efficiency and improved quality of electronic members.
| Title | Year | Author | Number |
|---|---|---|---|
| PASTE FOR SOLDERING ELECTRONIC APPARATUS | 0 |
|
SU1294544A1 |
| SOLDERING PASTE FOR TINNING AND SOLDERING ARTICLES OF RADIOELECTRONIC EQUIPMENT | 0 |
|
SU1532249A1 |
| SOLDERING PASTE | 0 |
|
SU1338994A1 |
| METHOD FOR WIRING RADIO ELEMENTS ON PRINTED CIRCUIT BOARD | 1992 |
|
RU2047286C1 |
| SOLDERING PASTE | 0 |
|
SU1338993A1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2004 |
|
RU2263569C1 |
| SOLDER PASTE | 2010 |
|
RU2450903C2 |
| SOLDER PASTE PREPARATION METHOD | 2020 |
|
RU2767945C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
| FLAX FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1524983A1 |
Authors
Dates
1995-12-10—Published
1991-06-27—Filed