RADIOELECTRONIC MEMBER SOLDERING PASTE Russian patent published in 1995 - IPC

Abstract RU 2049634 C1

FIELD: production of electronic equipment. SUBSTANCE: soldering paste contains mixture of tin-lead solder and flux with solder-flux ratio of 85: 15, and powder filler of molybdenum permalloy with the following ratio, by weight: filler 10-14; solder-flux mixture the balance. EFFECT: increased efficiency and improved quality of electronic members.

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RU 2 049 634 C1

Authors

Adamov Andrej Ehduardovich[Uz]

Dates

1995-12-10Published

1991-06-27Filed