FIELD: manufacture of electronic and radio-electronic devices, namely assembling of units and blocks on printed circuit boards and hybrid integrated circuits.
SUBSTANCE: flux contains derivative of rosin in the form of alkali metal resinate and water soluble alcohol or mixture of water soluble alcohols at next relation of components, mass %: alkali metal resinate, 15 - 60; water soluble alcohol or their mixture, 40 - 85. In order to change viscosity of flux the last may contain in addition water whose quality is in range of water content of water soluble alcohol.
EFFECT: lowered cost, simplified preparation of non-toxic easy-to-remove flux, high quality of soldered joints.
2 cl, 2 tbl, 5 ex
| Title | Year | Author | Number |
|---|---|---|---|
| FLUX FOR LOW TEMPERATURE SOLDERING | 2009 |
|
RU2400340C1 |
| SOLDERING PASTE BINDER | 2011 |
|
RU2454308C1 |
| WATER SOLUBLE FLUX FOR SOLDERING | 2019 |
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| FLUXING AGENT FOR SOFT SOLDERING | 2006 |
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| FLUX FOR SOLDERING BY EXTRA QUICK SOLDERS | 2012 |
|
RU2488472C1 |
| FLUX FOR SOLDERING AND TINNING WITH USE OF EASY-TO-MELT SOLDER | 2000 |
|
RU2208505C2 |
| 0 |
|
SU1779519A1 | |
| CHLORIDE FLUX FOR SOLDERING | 2015 |
|
RU2599063C1 |
| FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
| SOLDER PASTE | 2015 |
|
RU2591920C1 |
