FIELD: process engineering.
SUBSTANCE: proposed flux may be used wiring radioelectric components and IC on p.c.b. operated in harsh environment. Proposed flux contains the following components, in wt %: modified high-hydrated rosin ester-base synthetic resin - 10-20, activator consisting of carboxylic acid - 2-10, organic solvent representing mix of alcohols (30-50) and glycols (40). All components are ecologically safe and based on natural biodegradable stock. Solder does not contain amines, surfactants and water.
EFFECT: high surface electrical resistance.
4 tbl, 1 ex
Title | Year | Author | Number |
---|---|---|---|
SOLDER PASTE | 2010 |
|
RU2450903C2 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463143C2 |
SOLDER PASTE | 2016 |
|
RU2623554C1 |
SOLDER PASTE | 2010 |
|
RU2438845C1 |
SOLDER PASTE | 2016 |
|
RU2623571C1 |
DETERGENT | 2010 |
|
RU2445352C1 |
LIQUID CLEANING COMPOSITION | 2010 |
|
RU2445353C1 |
METHOD OF CONVERTING MATRIX-ARRANGED MICROCIRCUIT BALL LEADS MADE OF LEAD-FREE SOLDER INTO TIN-LEAD LEADS OF NEAR-EUTECTIC COMPOSITION AND SOLDER PASTE THEREFOR | 2013 |
|
RU2528553C2 |
SOLDER PASTE | 2015 |
|
RU2591920C1 |
Authors
Dates
2012-10-10—Published
2010-12-15—Filed