FIELD: soldering materials. SUBSTANCE: composition has, wt.-%: cordierite as a filler 11.5-20.6 and low-melting glass 79.4-88.5. Glass containing B2O3, SiO2, Al2O3, PbO, PbF2 and ZnO has additionally TeO2 at the following ratio of components, wt.-%: B2O3 10-13; SiO2 0.1-0.9; Al2O3 0.1-0.8; PbO 70-75; PbF2 5-10; ZnO 0.1-1.3, and TeO2 3.5-9. EFFECT: decreased soldering point of composition, increased stability of electrical parameters of integral scheme, decreased corrosion, increased output of ready equipments. 2 tbl
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Authors
Dates
1996-01-27—Published
1991-09-23—Filed