COMPOSITION FOR LOW-MELTING SOLDERING MATERIAL Russian patent published in 1996 - IPC

FIELD: soldering materials. SUBSTANCE: composition has, wt.-%: cordierite as a filler 11.5-20.6 and low-melting glass 79.4-88.5. Glass containing B₂O₃, SiO₂, Al₂O₃, PbO, PbF₂ and ZnO has additionally TeO₂ at the following ratio of components, wt.-%: B₂O₃ 10-13; SiO₂ 0.1-0.9; Al₂O₃ 0.1-0.8; PbO 70-75; PbF₂ 5-10; ZnO 0.1-1.3, and TeO₂ 3.5-9. EFFECT: decreased soldering point of composition, increased stability of electrical parameters of integral scheme, decreased corrosion, increased output of ready equipments. 2 tbl