FIELD: manufacture of gas-discharge indicator panels; soldering silicon plates in manufacture of integral sensors for protection of electron components and integrated circuits. SUBSTANCE: proposed composition contains the following components, mass-%: easily fusible glass, 44-83 and lead titanate, 17-56. Easily fusible glass includes the following components, mass-%: PbO, 72-92; B2O3, 5-20; Bi2O3, 01-18; PbF2, 0.1-15; ZnO, 0.1-10; SiO2, 0.1-3; Al2O3, 0.1-3; MnO, 0.1-2.0; CoO, 0.1-2.0; V2O5, 0.1-1.5. Junction forming temperature ranges from 390 to 465 C and temperature linear expansion coefficient of composition is equal to 83•10-7 1/°C at temperature 20-300 C. Proposed composition may additionally contain CuO in the amount of 0.1-3.0 mass-%. Proposed composition ensures reliable adhesion to substrate, thus enhancing mechanical strength and vacuum tightness of articles. EFFECT: enhanced efficiency; increased yield of articles. 2 cl, 2 tbl
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Authors
Dates
2003-01-27—Published
2000-05-29—Filed