METHOD FOR MANUFACTURE OF FLEXIBLE PRINTED CIRCUIT BOARDS Russian patent published in 2008 - IPC H05K3/00 H05K3/10 

FIELD: radio-electronics, applicable in manufacture of flexible printed circuit boards used in the radio electronic equipment.

SUBSTANCE: a copper process layer, 4 ÷ 6 μm thick, is electrolytic-applied onto an aluminum galvanoplastic form, and then a positive photoresistive pattern of the electric conducting circuit. A resistive nickel layer, 4 ÷ 5 μm thick, is applied onto the patter spacing points, after that the copper electric conducting circuit, 20 ÷ 30 μm thick, is coated with a thin layer of polymer, 80 ÷ 100 μm thick. After that the galvanoplastic form is exfoliated and the copper process layer is dissolved. To obtain two-sided flexible printed circuit boards after the electrolytic precipitation of copper onto the electric conducting circuit, two boards are taken and interconnected by a layer of polyimide. Then, the galvanoplastic form is exfoliated and the copper process layer is dissolved.

EFFECT: enhanced reliability of the printed circuit boards, simplified and cheaper manufacturing method, enhanced labor productivity, and enhanced accuracy rating.