THERMAL CONDUCTING DIELECTRIC COMPOUND Russian patent published in 2018 - IPC H01L23/36 

FIELD: electrical engineering.

SUBSTANCE: invention relates to the field of heat-conducting dielectric materials and can be used for electrical insulation and for ensuring the removal of heat from elements of electronic equipment. Thermally conductive dielectric compound contains a polymeric binder and a powdery filler. To increase thermal conductivity and mechanical strength, the epoxy silicone resin SEDM-2 is used as the polymer binder with a silicon content of at least 5 % and epoxy groups of not less than 14 %, as a powdered filler – synthetic diamond AC6 100/80 and further comprises a low molecular weight polyamide resin L-20, which is a polyamine adduct with vegetable oil acids, with a certain ratio of components.

EFFECT: increase thermal conductivity and mechanical strength.

1 cl, 2 tbl