FIELD: contactless method for checking thermal properties of materials; electronic engineering. SUBSTANCE: specimen under analysis is irradiated by focused pulse laser beam and thermal radiation is recorded by means of infra-red photodiode in locally heated area of specimen. First, moment at which photosignal reaches maximum for the first time is recorded, then moment at which photosignal reaches its maximum for the second time. These moments correspond to zero value of specimen temperature derivative with respect to time. Device has two relatively centered planar p-n junctions. Their radii are chosen so that fields of vision of junctions are not overlapping and width of rings is set proceeding from requirement to ensure desired spatial resolution of device. EFFECT: provision for contactless inspection of thermal characteristics of materials. 3 cl, 2 dwg
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Authors
Dates
1997-01-27—Published
1993-03-01—Filed