FIELD: gluing compositions. SUBSTANCE: gluing composition has 10-14 wt. -% polyamide at m. p. 130-160 C and viscosity number 130-150 cm3/g that is polycondensation product of 30-50 wt.-% of E-caprolactam, 20-50 wt.-% of adipic acid salt and hexamethylenediamine and 20-30 wt.-% of sebacic acid salt and hexamethylenediamine; 0.6-0.7 wt.-% alcohol-soluble dye and mixture of solvents: 43-45 wt.-% tricresol, 21.3-22.4 wt.-% methylcellosolve, 21-22 wt.-% ethyl alcohol. Properties: gluing coating thickness is 0.025-0.030 mm, gluing strength at 20 C is 2.7H, at 100 C - 2.2H, temperature of reverse softening is 125-140 C at loading 0.8H, resistance at 100% moisture - above 10 days; composition endures adhesion to isolation at relative elongation 23%. EFFECT: enhanced quality of composition. 2 tbl
Title | Year | Author | Number |
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METHOD OF PREPARING ELECTROINSULATING VARNISH | 1994 |
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POLYURETHANE COMPOUND FOR INSULATING ELECTRICAL CONDUCTORS | 1994 |
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ELECTRIC INSULATION COMPOUND | 1993 |
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ADHESIVE FOR ENAMELED WIRES | 0 |
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CEMENTING THERMOPLASTIC COMPOSITION FOR ENAMELED-INSULATED WIRES | 0 |
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Authors
Dates
1997-05-20—Published
1994-04-21—Filed