FIELD: metal coating of dielectrics. SUBSTANCE: the offered method includes preliminary preparation of the surface by successive treatment of dielectric in solutions of hydroxide of alkali metal with concentration of 10-30 mas, % at temperature of 20-35 C for 10-25 min, hydrogen peroxide with concentration of 10-20 mas.% at temperature of 20-25 C for 30-45 min, and potassium permanganate with concentration of 5-10 mas.% at temperature of 20-35 C for 30-45 min, and formation of conducting layer by successive treatment in solutions of sulfide of alkali metal with concentration of 10-20 mas.% at temperature of 20-25 C for 20-45 min, and mixture of solutions of salts of metals from the group of soluble salts of copper, nickel, or lead with concentration of 15-25 mas.% with ammonia solution with concentration of 15-25 mas.% with their ratio of (405):1 for 20-45 min at temperature of 20-25 C. EFFECT: higher efficiency. 4 tbl
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Authors
Dates
1997-06-10—Published
1993-08-10—Filed