FIELD: microelectronics, monitoring of metallization area of printed circuit boards. SUBSTANCE: comparison electrode presents conductive plate submerged into electroplating bath together with metallized article. Protective nonconductive coat that forms conductive pattern created by elements of simple geometry is applied on to conductive plate. EFFECT: improved efficiency of process of manufacture of comparison electrodes. 2 dwg
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0 |
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SU539095A1 |
Authors
Dates
1998-09-10—Published
1992-03-06—Filed