FIELD: microelectronics, in particular, processes of applying dielectric materials with metal coating. SUBSTANCE: method involves preliminary preparation of substrate surface by means of degreasing and structuring, subsequent application of temperature- sensitive layer which consists of copper hypophosphite, its treatment by pulse laser. Substrate surface is structured by means of lamination of rough foil over surface of dielectric material and its subsequent removal using etching solutions. EFFECT: increased functional capabilities. 3 dwg, 1 tbl
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