SOLUTION FOR CHEMICAL COPPER PLATING OF DIELECTRICS Russian patent published in 1998 - IPC

Abstract RU 2114212 C1

FIELD: machine building, automotive industries, instrument making, and manufacture of domestic appliances. SUBSTANCE: solution of chemical copper plating of dielectrics comprises, g/l: copper sulfate, 2-5; complexing agent such as 25-% aqueous ammonia, 2-5; sodium hypophosphite, 50-100; trisodium phosphate, 5-15; hypophosphorous acid, 50-250; and glycol, 2-3. Use of solution makes it possible to reduce copper plating temperature to 15-20 C. EFFECT: improved properties of solution for chemical copper plating of dielectrics. 1 tbl

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RU 2 114 212 C1

Authors

Lomovskij O.I.

Fadeev E.I.

Dates

1998-06-27—Published

1996-05-12—Filed