FIELD: technology of manufacture of printed circuit boards from foiled dielectric material. SUBSTANCE: process of metal coating of holes in printed circuit boards involves preliminary treatment of workstocks of printed circuit boards in aqueous solution of base and their chemical metallization in aqueous solution of phosphorus- carrying salt of copper and base, thermal treatment, rinsing and build-up of metal by electroplating. Novelty of invention lies in cathode machining of copper surface of workstock of printed circuit board by current with density 0.8-1.0 A/sq.dm in process of metal coating. EFFECT: exclusion of pickling of copper from surface of printed circuit in process of chemical metal coating of holes, substantially decreased loss of working solution in process of activation of workstocks, widened possibilities of palladium-free metal coating. 1 tbl
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