FIELD: technology of applying metal conducting layers on ceramic backing and articles; manufacture of capacitors and decorative coats of ceramic articles. SUBSTANCE: both layers: intermediate layer (copper oxide) and metal layer are molded simultaneously at one stage through immersion of backing into mixture of aqueous solutions of copper and nickel hypophosphites followed by predrying and heat treatment at rather low temperature (260 to 280 C) for 10 to 60 minutes. EFFECT: simplification and low cost of technology of applying metal coats on ceramic articles. 1 tbl
Authors
Dates
1999-11-27—Published
1998-03-10—Filed