LIQUID-COOLED GROUP HEAT SINK Russian patent published in 1997 - IPC

FIELD: electrical engineering; converter sets to cool down pelletized semiconductor power devices. SUBSTANCE: heat sink has case 1 of high-heat-transfer material incorporating annular intersecting channels 2. Cover 3 soldered onto case and carrying inlet and outlet pipe unions 5 of semiconductor power devices forms closed-circuit hydraulic system. Axial diameter of annular channels D=/ I,5-I,I / D_spDmax, where D_spDmax is maximum overall diameter of cooled semiconductor power devices and their quantity m=2N+n at N= 2 and n=0, where N is number of cooled semiconductor power devices; n is actual set of numbers. Geometric centers of annular channels 2 are spaced 0.333D apart. Number pairs of inlet and outlet pipe unions 4 and 5 K_pu=0,5N and distance between adjacent pairs of inlet and outlet pipe unions L=2D. EFFECT: improved heat transfer efficiency and facilitated manufacture. 5 cl, 2 dwg