GROUP LIQUID-COOLED HEAT SINK FOR POWER SEMICONDUCTOR DEVICES AND MODULES Russian patent published in 1996 - IPC

FIELD: semiconductor engineering. SUBSTANCE: group heat sink has case of high-heat-conducting material with several intersecting concentric channel groups. Each group has external largest channel, internal smallest channel, and several intermediate channels. Cover is soldered on case to provide for closed-loop hydraulic system; cover carries inlet and outlet pipe unions. Entrance and exit pipe unions are arranged opposite nonintersecting sections of concentric channels of first and last groups so that cooling liquid is admitted to all concentric channels of groups simultaneously. Maximum diameter of external channel of group equals diameter of contacting surface of power semiconductor device case. Quantity of concentric channel groups, distances between centers of channel groups, and pipe union diameters are chosen from definite equations. EFFECT: improved cooling conditions. 2 dwg