METHOD AND APPARATUS FOR LASER CUTTING Russian patent published in 1998 - IPC

FIELD: machine engineering, namely, laser cutting of different materials. SUBSTANCE: method comprises steps of directing to cutting zone through jet of cutter focused laser irradiation with predetermined focal length and gas flow; moving scanning device of cutter relative to surface of blank along working plane; before cutting measuring statistic mean limit of blank bending value; placing blank onto spring-loaded platform; arranging cutter onto blank surface at forcing it for providing at working process constant contact of cutter and blank in range of its maximum bending value; correcting predetermined focal length at cutting process. Floating platform is mounted on table by means of springs with possibility of maintaining inclination angle of cutting plane equal to 87-93 deg relative to optical axis. Scanning device is in the form of spheric nozzle with radial depressed slits normal relative to optical axis of laser and inclined one relative to another by the same angles. Microswitches are mounted in lower part of platform. EFFECT: automatic correction of position of focal plane, possibility of providing constant focal length, protection of optical system, elimination of burr occurring on edges of articles. 2 cl, 1 tbl, 3 dwg