FIELD: microelectronics, radio engineering, computer technology, and jewelry industry. SUBSTANCE: chemical gold plating solution comprises 0.5-1.0 g/l (in terms of gold), 8.0-21.0 g/l complexing agent and demineralized water. Solution further contains 15-25 g/l lower alcohol and/or 0.003- 0.015 g/l alkali metal or ammonium carbonate. EFFECT: preparation of thin, pore-free, dense, mechanically strong gold coating with decorative effect. 4 cl, 2 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD OF PREPARING CHEMICAL GILDING SOLUTION | 2000 |
|
RU2166561C1 |
| METHOD OF ELECTROLYTIC SILVERING | 1992 |
|
RU2006530C1 |
| METHOD FOR FORMING A LAYER OF GOLD ELECTROCHEMICALLY DEPOSITED FROM ELECTROLYTES WITH pH = 6-7 ON THE SURFACE OF SILICON SEMICONDUCTOR STRUCTURES | 2021 |
|
RU2778998C1 |
| METHOD OF DECORATION OF ARTISTIC PRODUCTS WITH IMITATION OF GILDING | 1998 |
|
RU2140362C1 |
| METHOD OF ELECTROPLATING | 1999 |
|
RU2166569C1 |
| ELECTROLYTE FOR DEPOSITION OF COATINGS FROM COPPER-TIN ALLOY | 1994 |
|
RU2133306C1 |
| METHOD OF ELECTROPLATING OF REMOVABLE DENTURES | 2011 |
|
RU2469697C1 |
| METHOD FOR CHEMICAL NICKEL PLATING OF ALUMINIUM CONTACT PADS BEFORE IMMERSION PLATING | 2015 |
|
RU2605737C2 |
| PROCESS OF CHEMICAL-PHOTOGRAPHIC PROCESSING OF COLOR CONVERTIBLE HALOGEN-CARRYING PHOTOGRAPHIC MATERIALS | 1996 |
|
RU2118840C1 |
| ELECTROLYTE FOR CADMIUM PLATING | 1999 |
|
RU2153029C1 |
