FIELD: method of manufacture of multilayer printed wiring board. SUBSTANCE: the board has two electric-insulating substrates with conducting tracks or layers formed at least on three their surfaces superposed under pressure, the main cured substrate based on synthetic material reinforced by unidirectionally oriented fibres, furnished with conducting tracks on its each side is connected to the intermediate substrate; in the process of superposition the intermediate substrate is added to the main one, the main and intermediate substrates have a unidirectionally reinforced layer of cured filler; the main substrate has a layer of plastic-deformed (fluid) adhesive applied at least onto its one side, facing the intermediate substrate, and pressure is applied to laminated material for arrangement of the intermediate substrate in contact with conducting tracks of the main substrate; the cavities between these tracks are filled with adhesive material for connection of the main and intermediate substrates. EFFECT: enhanced precision of total thickness of laminated material without considerable expenditures. 17 cl
