ARMORED MULTIPLE-LAYER PLASTIC MATERIALS FOR MANUFACTURING OF PRINTED CIRCUITS, METHODS FOR MANUFACTURING OF SUCH MATERIALS AND RESULTED DEVICES Russian patent published in 1997 - IPC

FIELD: microelectronics, in particular, manufacturing of substrates of printed circuits. SUBSTANCE: method involves generation of multiple-layer structure by means of parallel winding of dielectric threads on flat case, saturating this structure by binder in vacuum. Binder is either epoxy resin, polyimide, or polyester, or bis-maleic- imide or vinyl ether or phenol-aldehyde resin or melamine or polyphenylbutazone. EFFECT: increased functional capabilities. 57 cl, 35 dwg, 1 tbl