METHOD OF MANUFACTURE OF MULTILAYER PRINTED WIRING BOARDS AND MULTILAYER PRINTED WIRING BOARD Russian patent published in 1999 - IPC

FIELD: multilayer printed wiring boards. SUBSTANCE: multilayer printed wiring boards, known as multilayers, have at least two insulated substrates with a conducting pattern or layers made at least on three their surfaces; by attaining a layer structure under pressure the hardened base substrate on the basis of UD-reinforced synthetic material with a pattern on both sides is combined and connected to the auxiliary (rear) substrate added to the base substrate; the auxiliary substrate, having UD-reinforced hardened layer of hard filler, has a layer of plastically deformed (fluid) binder at least on the side facing the conducting pattern of the base substrate; and its laminate exerts such a pressure so as to bring in contact the hardened layer of the auxiliary (rear) substrate and the conducting pattern of the base substrate, and the binding material would fill the emptinesses between this pattern for connection of the base and auxiliary (rear) substrates. EFFECT: enhanced electric properties and quality of printed wiring boards. 24 cl, 16 dwg