FIELD: radio engineering.
SUBSTANCE: radioelectronic unit consists of a package of printed circuit-boards with adjacent contact areas at the face and back sides of the package boards with body bearing elements, cover and bottom, terminal blocks made of insulation material with spring contact areas and package clamping elements; from the back side of printed-circuit boards there bonded metal plates. Additionally radioelectronic unit contains microcircuit chips; body bearing elements, cover and bottom are covered by copper layer with nickel layer above at the inner surface of the bottom, nickel layer has windows filled with solder layer in which microcircuit chip bodies are embedded attached to the bottom.
EFFECT: provision of required specified temperature and interference immunity despite of ambient temperature in radioelectronic unit location area necessary for its stable and safe operation.
5 dwg
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