FIELD: chemical industry. SUBSTANCE: described is thermoplastic polyimide of general formula: Ar1, Ar4 wherein R1 contain at least one organic radical of structure (a)-(c); R2, CH3, CH2CH3 is H, 
, phenyl. EFFECT: reliable adhesion properties at low temperature and good resistance to radioactive irradiation. 6 cl, 1 dwg, 6 ex, 2 tbl
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