SUBSTRATE, METHOD FOR ITS PRODUCTION (VERSIONS) AND METALLIC COMPOUND OF ARTICLES Russian patent published in 2003 - IPC

FIELD: development of circuit subtrates or heat-radiating substrates used, for example, in semiconductor devices. SUBSTANCE: substrate has a metallic circuit and/or a heat-radiating metal plate formed on a ceramic base made in the form of a connected article including the first metal and second metal, and/or the first metal, third metal and second metal. The first metal is selected to the ceramic substrate. The first metal is selected from a group including aluminium, lead, platinum and an alloy containing at least one of these metals; the second metal, a group including copper, silver, gold, aluminium and an alloy containing at least one of these metals, and the third metal, a group including titanium, nickel, zirconium, molybdenum, tungsten and an alloy containing at least one of these metals. EFFECT: enhanced stability of the substrate at cyclic thermal loads. 11 cl, 2 tbl